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B384F120T30
BCM TM
Bus Converter
? 384 V to 12 V V?I Chip TM Converter
? Typical efficiency 95%
? 300 Watt (450 Watt for 1 ms)
? High density – up to 1017 W/in 3
? Small footprint – 260 W/in 2
? Low weight – 0.5 oz (15 g)
? 125°C operation (T J )
? <1 μs transient response
? >3.5 million hours MTBF
? No output filtering required
Vin = 360 - 400 V
Vout = 11.3 - 12.5 V
Iout = 25 A
?
? ZVS / ZCS isolated sine
amplitude converter
Product Description
K = 1/32
Rout = 20.0 m ? max
Absolute Maximum Ratings
The V?I Chip bus converter is a high efficiency (>95%),
narrow input range Sine Amplitude Converter TM (SAC TM )
operating from a 360 to 400 Vdc primary bus to deliver
an isolated low voltage secondary (ELV).
The off-line BCM provides an isolated 11.3 -12.5 V
distribution bus and is ideal for use in silver boxes and
PFC front ends. Due to the fast response time and low
noise of the BCM, the need for limited life aluminum
electrolytic or tantalum capacitors at the input of POL
converters is reduced—or eliminated—resulting in
savings of board area, materials and total system cost.
The BCM achieves a power density of 1017 W/in 3 in
a V?I Chip package compatible with standard pick-and-
place and surface mount assembly processes. The
V?I Chip package provides flexible thermal management
through its low junction-to-case and junction-to-board
Parameter
+In to -In
PC to -In
+Out to -Out
Isolation voltage
Output current
Peak output current
Output power
Peak output power
Case temperature
Operating junction temperature (1)
Storage temperature
Values
-1.0 to 440
500
-0.3 to 7.0
-0.5 to 16.0
4242
27.7
37.5
300
450
225
245
-40 to 125
-40 to 125
Unit
Vdc
Vdc
Vdc
Vdc
Vdc
A
A
W
W
°C
°C
°C
°C
Notes
For 100 ms
Input to Output
Continuous
For 1 ms
Continuous
For 1 ms
MSL 5
MSL 6
T-Grade
T-Grade
thermal resistance. Owing to its high conversion
efficiency and safe operating temperature range, the
BCM does not require a discrete heat sink in typical
applications. Low junction-to-case and junction-to-lead
thermal impedances assure low junction temperatures
and long life in the harshest environments.
Note:
(1) The referenced junction is defined as the semiconductor having the highest temperature.
This temperature is monitored by a shutdown comparator.
Part Numbering
B
Bus Converter
Module
384
Input Voltage
Designator
F
120
Output Voltage
Designator
(=V OUT x10)
T
30
Output Power
Designator
(=P OUT /10)
Configuration
F = J-lead
T = Through hole
Product Grade Temperatures (°C)
Grade Storage Operating (T J )
T -40 to125 -40 to125
vicorpower.com
800-735-6200
V?I Chip Bus Converter
B384F120T30
Rev. 2.4
Page 1 of 12
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B384T120T30 功能描述:HV BCM BUS CONVERT 12V 300W RoHS:是 类别:电源 - 板载 >> DC DC 转换器（分解式） 系列:V-I Chip™, BCM™ 应用说明:Factorized Power Architecture and V-I Chips 产品培训模块:VI Chip Bus Converter Modules 标准包装:1 系列:V-I Chip™, BCM™ 类型:总线转换器模块 输出数:1 电压 - 输入（最小）:330V 电压 - 输入（最大）:365V 输出电压:12.5V 电流 - 输出（最大）:24A 电源（瓦） - 制造商系列:300W 电压 - 隔离:4.242kV（4242V） 应用:商用 特点:具有远程开/关功能和 UVLO 安装类型:通孔 封装/外壳:模块 尺寸/尺寸:1.28" L x 0.87" W x 0.26" H（32.5mm x 22.0mm x 6.7mm） 包装:托盘 工作温度:-55°C ~ 125°C 效率:95.3% 电源（瓦特）- 最大:300W 重量:0.031 磅（14.06g）
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